Sebastian, a veteran of a tech writer with over 15 years of experience in media and marketing, blends his lifelong fascination with writing and technology to provide valuable insights into the realm of mobile devices.
TSMC, supplier of Apple’s silicon chips for iPhones and iPads, could build an advanced packaging capacity in Japan, according to two sources familiar with the matter.
“One option the chipmaking giant is considering is bringing its chip on wafer on substrate packaging technology to Japan, according to one of the sources who was briefed on the matter”, reads the report. The Chip on Wafer on Substrate packaging technology is a method used in creating electronic circuits where multiple chips are first mounted on a semiconductor wafer, and then the entire assembly is attached to a larger substrate. This technique allows for a high-density integration of chips, enabling the creation of more compact and efficient electronic devices. The process involves stacking chips vertically and connecting them both to each other and to the substrate below.
It’s like building a mini skyscraper on a tiny piece of land. This method lets you fit a lot more power into a small space, kind of like stacking apartments to make the most of a small plot of land in a city. It's a smart way to make electronic devices smaller, faster, and more efficient.Demand for advanced semiconductor packaging has surged globally in tandem with the artificial intelligence boom, spurring chipmakers, including TSMC, Samsung Electronics and Intel, to boost capacity.
TSMC said it was planning additional advanced packaging capacity in Chiayi in southern Taiwan to respond to strong market demand.A discussion is a place, where people can voice their opinion, no matter if it is positive, neutral or negative. However, when posting, one must stay true to the topic, and not just share some random thoughts, which are not directly related to the matter.Multiple accounts - one person can have only one accountModeration is done by humans.
United Kingdom Latest News, United Kingdom Headlines
Similar News:You can also read news stories similar to this one that we have collected from other news sources.
TSMC considering advanced chip packaging capacity in Japan, sources sayTSMC is considering building advanced packaging capacity in Japan, sources say, potentially boosting Japan's semiconductor industry.
Read more »
Intel will bring a performance-improving feature to its chips one year ahead of TSMCAlan, an ardent smartphone enthusiast and a veteran writer at PhoneArena since 2009, has witnessed and chronicled the transformative years of mobile technology. Owning iconic phones from the original iPhone to the iPhone 11 Pro Max, he has seen smartphones evolve into a global phenomenon.
Read more »
Emily Ratajkowski, Sebastian Bear-McClard's Family Album With SonEmily Ratajkowski and Sebastian Bear-McClard called it quits one year after they welcomed their son, Sylvester Apollo — all the details
Read more »
Sebastian Lletget Responds to Becky G Cheating Rumors, Says He's Being ExtortedSoccer star Sebastian Lletget says he's the victim of an 'extortion plot' amid rumors he cheated on his fiancee, Becky G -- but admits he did, in fact, screw up.
Read more »
Sebastian Stan calls out journalist who refers to his new character with disfigurement as a 'beast'Sebastian Stan corrected a journalist who called his new 'A Different Man' character, who has facial disfigurement, a 'beast' during a panel interview.
Read more »
'We have not forgotten about Sebastian': Search continues for missing teenThe Tennessee Bureau of Investigation (TBI) is asking the public not to forget about Sebastian Rogers, a teenager who has been missing for almost three weeks.
Read more »