Lawrence is a contributing reporter at Engadget, specializing in our AI overlords, musical doodads and, of course, garden variety gaming and tech. To that end, Lawrence once lost badly in multiplayer Mario to Nintendo’s own Shigeru Miyamoto, who laughed gleefully as he threw him down a pit.
Taiwan Semiconductor Manufacturing Company is receiving $6.6 billion in grants to build three fabrication plants, otherwise called fabs, in the region of Phoenix , Arizona . This is in addition to around $5 billion in government loans .
One nifty aspect of these factories is that they’ll allow TSMC to complete every aspect of the chip-making process on US soil, including advanced packaging. I’m not talking about slapping a box and warranty information around the chip. In this context, packaging refers to arranging the various components to build the final product, in addition to adding power, inputs and outputs.
The White House says this investment, along with other CHIPS Act grants and loans, will turn the US into a global chip-making powerhouse. The federal government suggests that the US will manufacture 20 percent of the world’s leading-edge chips by 2030.
TSMC White House Act Grants Phoenix Arizona President Biden Foreign Direct Investment Semiconductor Manufacturers Government Loans Factories
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