AMD unveiled a range of new CPUs at CES, highlighting advancements in AI capabilities and the return of 3D V-cache technology to notebooks.
AMD introduced a wide range of CPUs at CES this week, encompassing high-end desktop processors to those targeted for gaming notebooks, handhelds, and AI PCs. These latest chips incorporate the XDNA 2 NPU and Zen 5 CPU cores. Notably, the top-tier Strix Halo components feature up to 40 RDNA 3.5 GPU cores, delivering a combined 126 TOPS. While NPU s are traditionally associated with AI PCs, not all AI tasks are optimized for them.
Large language models often run on GPUs due to their memory demands. AMD's Strix Halo, with its 256-bit bus, aims to address this by providing 256GB/s bandwidth, theoretically enabling the local execution of large language models like Llama 3.2 3B at over 100 tokens per second. However, these new chips have a reduced memory capacity compared to their predecessors, with a maximum of 128GB of LPDDR5x, compared to the 256GB of DDR5 supported by Strix Point. AMD will offer Strix Halo processors with Pro features, including fleet management, enterprise security, and cloud recovery services, later this quarter. AMD also announced an expansion of its AI 300 product family with four SKUs featuring lower core counts, both with and without AMD Pro features. Among the announcements was the 9955HX3D, which brings back AMD's 3D V-cache packaging technology to the notebook market
AMD Cpus AI 3D V-Cache CES Ryzen Strix Halo Llms GPU NPU
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