Boss Mark Liu says silicon ready but advanced packaging isn't
Bad news for anyone looking to get their hands on Nvidia's top specced GPUs, such as the A100 or H100: it's not going to get any easier to source the parts until at least the end of 2024, TSMC has warned.
The problem, it seems, isn't that TSMC – which fabricates not just those GPUs for Nvidia but also components for AMD, Apple, and many others – can't make enough chips. Rather, a lack of advanced packaging capacity used to stitch the silicon together is holding up production, TSMC chairman Mark Liu toldAccording to Liu, TSMC is only able to meet about 80 percent of demand for its chip on wafer on substrate packaging technology.
Liu expects this is a temporary bottleneck in the production of machine-learning accelerators and that additional CoWoS capacity should come online within a year and a half. Incidentally, TSMC recently announced plans toits advanced packaging capacity in Taiwan with a $3 billion facility at the Tongluo Science Park in Miaoli County.
Until TSMC can bring additional capacity online, Nvidia's H100 and older A100 – which power many popular generative AI models, such as GPT-4 – are at the heart of this shortage. However, it's not just Nvidia.
We've reached out to AMD for comment on whether the shortage of CoWoS packaging capacity could impact availability of the chip and we'll let you know if we hear anything back.
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